24 May, 2023

A Brief Introduction to Dicing Process

What is the Process of Dicing?

Silicon wafers are often divided into individual chips using the dicing process in the semiconductor packaging industry. Many processes are used in the production of integrated circuits to transform raw materials into packaged components that may be assembled into electronic circuits. The Dicing process, to put it another way, is a method for dividing the silicon wafer from the die. Wafers are mounted on metal frames using PVC, which has a sticky backing that holds the wafer in place during the dicing procedure.

Because even the smallest dust particles could destroy the delicate circuits imprinted on a wafer, the wafer dicing technique is performed in a clean room with constant air circulation. Depending on how it is used, the tape has a variety of characteristics. Whereas non-UV dicing tape is used for larger die sizes, UV-curable tapes are used for smaller die sizes. The die stays on the tape after a wafer has been cut into slices until it is removed by equipment like a die bonder. The dies are typically square or rectangular. Depending on the dicing method employed, they might also assume other shapes.

The 300mm wafer dicing services process includes mechanical sawing, laser cutting, scribing, and breaking. The development of chipping and blade yielding are the two main drawbacks of the dicing process. It is advised to use a unique monitoring technique to estimate the maximum feed rate without exceeding these restrictions. Processes of wafer dicing are frequently entirely automated to ensure quality, accuracy, and consistency.

To meet customer needs, the company has embraced constant development and progress. Precise and adaptable approaches are employed to guarantee that the actual units produced are of a high caliber and dependable to maintain competitiveness in the face of change. To increase die strength, it is crucial to optimize chippings during package construction. Die strength directly affects the dependability and quality of the package in terms of pre-assembly procedures. By examining important factors and gathering, analyzing, and summarizing data from many sources, the analyst gives a comprehensive picture of the market.

Attaching a Wafer to the Tape Frame

Plasticized PVC film adhesive tape is one of the most dependable materials used in the assembly and handling of semiconductor devices. It is widely used in processes including wafer row expansion, wafer scribing, sawing, and fracturing as well as die transfer and bonding. With the extensive and expanding use of processing tape with a wide range of application features, it is advantageous for the user to comprehend the principles of defining and dealing with tape. The success or failure of using plasticized PVC film tape for semiconductor processing depends on the choice of tape (such as in 300mm wafer dicing services). After the tape is applied, trim any extra using the cutter before unloading the mounted wafer.

Process for Dicing with Blades

An adhesive-backed tape is used to attach wafers to a metal frame. The hoover throw of the dicing saw tightens the wafer outline. For 300mm wafer dicing services, the spindle speed should be between 15,000 and 30,000 RPM. The sharpening diamond particles are protected by a diamond bond matrix, which allows them to readily penetrate the material, lower loads, and produce exceptional cut quality.

Another reason to dress a loaded blade is to get rid of debris that is clogging the gaps between the abrasive particles. For the diamonds to easily enter the cutting substance during wafer dicing, they must be fully protruded and exposed. Unkempt dicing sharp edges will generally push the material, bringing about high loads, high cutting temperature/intensity, and unfortunate cut quality. Blade damage is probably possible as a result.

Micro-washing Method

It is possible to clean semiconductor components of alkali, metals, heavy metals, and organic impurities without damaging the wafer. Cleaning techniques grow increasingly challenging as technology advances and gadgets get smaller. The utilized apparatus and equipment should also be cleaned in addition to the wafers. Wafer contaminants include, among other things, organic and inorganic pollutants, impurities, and particles with diameters ranging from 0.10 to 20 microns.

This technique is used to clean the wafer after dicing. This process uses water that has undergone deionization (DI). Finishing the removal of any impurities and particles that may have been left over from wafer operations or that may have been deposited on the wafers’ surfaces is crucial. To lessen the likelihood of faults in the finished product, this procedure must be taken. The surfaces where etching will take place may become blocked by unwanted particles or contaminants, leading to unfavorable outcomes.

There are two steps to the wafer cleaning process. In the first stage, DI water is sprayed onto the wafer, which is secured by the iron frame, at a pressure of between 100 and 150 psi.

Die Sorting and Inspection of Wafers

Before assembly, the die sorting and inspection system examines dies, allowing customers to quickly see any errors in wafer-level package dicing. New materials that can break during dicing have been incorporated into wafer-level packaging technologies, such as low-k materials in fan-in wafer-level packages. This approach helps chip makers reduce production risk and enhance output quality for the following assembly stage by quickly identifying problems during die sorting. Wafer inspection, a technique for finding faults on a wafer, is more complex, expensive, and time-consuming with each node.

Wafers can be inspected either before or after dicing. With optical wafer inspection, the die that is visible to the unaided eye is eliminated. These errors can have been the result of poor handling during post-production processes or the manufacturing process. While occasionally manual inspection techniques are used, automated technology handles the majority of visual checks. This technique is used to examine the wafer’s die rejections following the dicing procedure. During the mechanical sawing procedure, problems like edge chipping, layer peeling, and cracking may occur. The expectation is that every die on a single wafer will be identical, although this is not necessarily the case.


Leave a Reply

Your email address will not be published. Required fields are marked *